Pin numbering for various IC packages

Last update: 5 February 2005

SIP package

SIP pin numbering

This numbering method is used for these packages:

SIP (Single In-line Package)
SIL (Single In-Line)

DIP package

DIP pin numbering

This numbering method is used for these packages:

DIP (Dual In-line Package)
DIL (Dual In-Line)
SDIP (Shrink Dual In-line Package)
SO (Small Outline)
SOIC (Small Outline Integrated Circuit)
SOJ (Small Outline J-leaded)
SOP (Small Outline Package)
SSOP (Shrink Small Outline Package)
TSOP (Thin Small Outline Package)

ZIP package

ZIP pin numbering

This numbering method is used for these packages:

ZIP (Zig-zag In-line Package)

PGA package

PGA pin numbering

This numbering method is used for these packages:

PGA (Pin Grid Array)
BGA (Ball Grid Array)

PLCC package

PLCC pin numbering

This numbering method is used for these packages:

PLCC (Plasic Leaded Chip Carrier)
QFP (Quad Flat Package) used by Motorola, Freescale
PQFP (Plasic Quad Flat Package) used by Motorola, Freescale

QFP package

QFP pin numbering

This numbering method is used for these packages:

QFP (Quad Flat Package)
PQFP (Plasic Quad Flat Package)
PLCC (Plasic Leaded Chip Carrier) used by Intel

Notes:

All drawings are shown from the top of the component, i.e. the component side of the PCB
When the package is in small print, then the numbering method is an alternative method for this package.

Copyright © 2002-2005 Ronald van Dijk - All rights reserved